The glass substrate for chip packaging has feature of dust-proof which mainly applied in field of automotive.
Prodution Capability
Materials : | White glass |
Dimension (Max.) : | Ф300*0.4 |
Dimension (Min.) : | 125*125*0.4 |
Coating type : | AR/CR+AR |
Wavelength range : | 380nm-780nm |
Appearance : | Dot <7um |
Aaccuracy : | ＜±0.015mm |
* Specification can be adjusted in according to customer's requirement. | |
